ct.\*:("Lithography, masks and pattern transfer")
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Mechanisms of photoresist dissolutionHUNEK, Balazs; CUSSLER, E. L.AIChE journal. 2002, Vol 48, Num 4, pp 661-672, issn 0001-1541Article
Electrochemical etching in HF solution for silicon micromachiningBARILLARO, G; NANNINI, A; PIOTTO, M et al.Sensors and actuators. A, Physical. 2002, Vol 102, Num 1-2, pp 195-201, issn 0924-4247, 7 p.Article
Direct microfabrication using an X-ray micro-beamKATOH, Takanori; ZHANG, Yanping; KAGOSHIMA, Yasushi et al.Sensors and actuators. A, Physical. 2002, Vol 97-98, pp 725-728, issn 0924-4247, 4 p.Conference Paper
Contamination control methods for gases used in the microlithography processRABELLINO, Larry; APPLEGARTH, Chuck; VERGANI, Giorgio et al.SPIE proceedings series. 2002, isbn 0-8194-4435-9, 2Vol, vol 2, 790-801Conference Paper
Strength and leak testing of plasma activated bonded interfacesVISSER, M. M; WEICHEL, S; DE REUS, R et al.Sensors and actuators. A, Physical. 2002, Vol 97-98, pp 434-440, issn 0924-4247, 7 p.Conference Paper
Effects of chemical pre-treatments on the etching process of p(100) Si in tetra-methyl ammonium hydroxide solutionCONWAY, Elizabeth M; CUNNANE, Vincent J.Journal of micromechanics and microengineering (Print). 2001, Vol 11, Num 3, pp 245-256, issn 0960-1317Article
Microfabrication of thick tungsten films for use as absorbers of deep X-ray lithography masksOKUYAMA, H; HIRATA, Y; TAKADA, H et al.Microsystem technologies. 2001, Vol 7, Num 2, pp 80-84, issn 0946-7076Article
A Monte Carlo study of etching in the presence of a mask junctionVAN VEENENDAAL, E; CUPPEN, H. M; VAN ENCKEVORT, W. J. P et al.Journal of micromechanics and microengineering (Print). 2001, Vol 11, Num 4, pp 409-415, issn 0960-1317Article
Amplification in light-induced reaction of Cu with Cl2 in the VUVRAAF, H; GROEN, M; SCHWENTNER, N et al.Applied surface science. 2000, Vol 154-55, pp 536-541, issn 0169-4332Conference Paper
Modular monitoring for the photolithography environmentWACHS, A.SPIE proceedings series. 2000, pp 573-579, isbn 0-8194-3616-XConference Paper
Process variations of thin films and antireflective coatingsCOHEN, Y; BRAITBART, O.SPIE proceedings series. 2000, pp 703-711, isbn 0-8194-3616-XConference Paper
Printability of reticle repairs in a 248nm DUV production environmentGERARD, X; DELORAINE, L; SUNDERMANN, P et al.SPIE proceedings series. 2000, pp 321-329, isbn 0-8194-3616-XConference Paper
Computer modeling of charging induced electron beam deflection in electron beam lithographyHWU, J. J; KO, Y.-U; JOY, D. C et al.SPIE proceedings series. 2000, pp 239-246, isbn 0-8194-3616-XConference Paper
Wafer-level colinearity monitoring for TFH applicationsMOORE, P; NEWMAN, G; ABREAU, K et al.SPIE proceedings series. 2000, pp 580-587, isbn 0-8194-3616-XConference Paper
Advanced e-beam reticle writing system for next generation reticle fabricationNAKAHARA, Tetsuji; MIZUNO, Kazui; ASAI, Suyo et al.SPIE proceedings series. 2000, pp 594-604, isbn 0-8194-3702-6Conference Paper
Analysis of reticle deformation, reduction ratio and MEEF of future optical lithographyKOTOKU, Kenichi; MIKAMI, Koji; EBINUMA, Ryuichi et al.SPIE proceedings series. 2000, pp 56-65, isbn 0-8194-3702-6Conference Paper
Cluster tool solution for fabrication and qualification of advanced photomasksSCHÄTZ, Thomas; HARTMANN, Hans; ERAN, Yair et al.SPIE proceedings series. 2000, pp 84-92, isbn 0-8194-3702-6Conference Paper
Comparative study on MEEF and dose latitude between attenuated PSM and Cr binary maskCHO, Hyun-Joon; KIM, Yong-Hoon; CHOI, Sung-Woon et al.SPIE proceedings series. 2000, pp 17-23, isbn 0-8194-3702-6Conference Paper
Development of a fast line width correction systemTAKENOUCHI, Ryuji; ASHIDA, Isao; KAWAHIRA, Hiroichi et al.SPIE proceedings series. 2000, pp 688-696, isbn 0-8194-3702-6Conference Paper
Effective OPC pattern generation using Chemically Amplified Resist for 0.13μm design rule masksLEE, Il-Ho; NAM, Kyung-Han; KIM, Hong-Suk et al.SPIE proceedings series. 2000, pp 705-715, isbn 0-8194-3702-6Conference Paper
Elements of an advanced pattern generator for 130-100 nm maskmakingCHAKARIAN, Varoujan; SAUER, Charles; GHANBARI, Abe et al.SPIE proceedings series. 2000, pp 580-593, isbn 0-8194-3702-6Conference Paper
Evaluation of loading effect of NLD dry etchingIWAMATSU, Takaytiki; FUJISAWA, Tatsuya; HIRUTA, Koji et al.SPIE proceedings series. 2000, pp 235-242, isbn 0-8194-3702-6Conference Paper
Fabrication process of alternating phase shift mask for practical useISHIWATA, Naoyuki; KOBAYASHI, Takema; YAMAMOTO, Tomohiko et al.SPIE proceedings series. 2000, pp 315-326, isbn 0-8194-3702-6Conference Paper
High-contrast I-line positive photoresist for laser reticle writerKOBAYASHI, Y; OPPATA, Y; EZOE, Y et al.SPIE proceedings series. 2000, pp 289-294, isbn 0-8194-3702-6Conference Paper
Improvement of defect density for DUV halftone PSMLEE, K. Y; KIM, L. J; YEON, K. M et al.SPIE proceedings series. 2000, pp 388-393, isbn 0-8194-3702-6Conference Paper